The SPD300 chip grinding machine is a high-end precision processing equipment tailor-made for the semiconductor industry. It is precisely adapted to 6-12-inch conventional wafers and various special precision chip substrates, and is an indispensable core equipment in the precision processing link at the back end of the semiconductor industry chain. This equipment is equipped with high-precision CNC spindles and a fully closed-loop intelligent control system. The grinding thickness control accuracy is as high as ±2μm. It supports processing of standard specifications such as 1*1mm² and 2*2mm², and can also be customized to specific sizes according to customer requirements. After processing, the surface roughness Ra of the workpiece is ≤0.01μm, which can achieve undamaged and uniform grinding of the chip throughout the entire area, significantly reducing defects such as warping and edge chipping of the workpiece, and effectively improving the qualification rate of finished chip products.
The equipment is equipped with an intelligent variable frequency speed regulation system, enabling precise and refined control of the grinding rate. It has a processing capacity of over 20 kilograms per hour and supports large-scale continuous operation. The body adopts a high-rigidity integrated casting structure, combined with a high-definition and user-friendly touch operation interface. The setting of process parameters is intuitive and simple, and daily operation and maintenance are effortless and efficient. The equipment is equipped with built-in overload protection, and its safety performance fully complies with the safety grade requirements of O6-O7 and E5-E7 in the DIN66399 standard, providing all-round protection for operation safety. With top-notch precision processing performance, stable and reliable operation output, and strong scene adaptability, the SPD300 chip grinding machine can effectively help semiconductor enterprises break through the technical bottlenecks of precision processing, optimize core production processes, comprehensively improve the quality of chip processing and overall production capacity, and promote the precision upgrade of the industry.
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