The SPD350 chip grinding machine is a high-end specialized equipment specially designed for the precise thinning and planar grinding of semiconductor chips and wafers. It is also an indispensable key precision equipment in the core links of chip packaging and wafer manufacturing processes, combining professionalism and versatility.
The whole machine is equipped with an intelligent numerical control system, with the grinding rate precisely adjustable, significantly enhancing production efficiency and effectively reducing the risk of defects such as chipping and micro-damage of workpieces. The equipment strictly complies with the DIN 66399 standard E7 safety level, with both precision and compatibility reaching the maximum. It is widely used in core semiconductor fields such as integrated circuits, power devices, and optoelectronic chips. It can not only adapt to small and medium-sized batch R&D and trial production but also meet the demands of large-scale mass production, helping semiconductor manufacturers achieve efficient and high-quality precision grinding processing. It is the preferred equipment for the precision manufacturing process of semiconductors.
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The processing capacity of a single machine exceeds 80 kilograms per hour, with a prominent advantage in production capacity
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The core processing accuracy is strictly controllable, and the grinding thickness accuracy can reach ±2μm
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The output size supports standard specifications of 1×1mm² and 2×2mm², as well as personalized customization
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The surface roughness Ra is less than 100nm, and the non-uniformity of grinding is less than 5%
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